Etching is the process of selectively removing unwanted materials from the surface of a silicon wafer by chemical or physical methods. It is a general term for stripping or removing materials through solutions, reactive ions or other mechanical methods. Etching technologies are mainly divided into dry etching and wet etching. Dry etching mainly uses reactive gases and plasma for etching, while wet etching relies on chemical reactions between chemical reagents and the material being etched. Semicon Global Tech provides MEMS foundry services for universities and research institutes, with experience in multiple etching methods.

Wafer bonding is a technology in which two homogeneous or heterogeneous semiconductor materials with clean and atomically flat surfaces are directly joined after surface cleaning and activation. Under certain conditions, van der Waals forces, molecular forces or even atomic forces bond the wafers into an integrated structure. Semicon Global Tech provides MEMS foundry services for universities and research institutes, with experience in multiple wafer bonding technologies.

Dicing, sometimes called wafer scribing, is an indispensable step in the chip manufacturing process and belongs to the back-end stage of wafer manufacturing. Its purpose is to separate each independent IC/MEMS on the wafer by laser or a high-speed rotating diamond blade, so that individual IC/MEMS devices can be attached, bonded and packaged in subsequent processes. Semicon Global Tech provides MEMS foundry services for universities and research institutes, with experience in laser dicing, blade dicing and other semiconductor dicing technologies.

Before wafer packaging, excess substrate material on the wafer backside usually needs to be removed to a certain thickness; this process is called wafer thinning. In the back-end process, wafers with circuits already formed on the front side undergo backside thinning before subsequent dicing, wire bonding and packaging. This reduces packaging and mounting height, decreases chip package volume, improves heat dissipation efficiency, electrical performance and mechanical performance, and reduces the workload for dicing. Semicon Global Tech provides MEMS foundry services for universities and research institutes, with experience in mechanical grinding, chemical mechanical polishing and other semiconductor wafer thinning technologies.

Electroplating uses chemical methods to deposit precious metals on specific electrodes. Its basic principle is similar to conventional electroplating, but it offers higher precision and control. Electroless plating refers to the deposition of metal ions from an aqueous solution onto a substrate through chemical reduction under controlled conditions without applying an external current. Semicon Global Tech provides MEMS foundry services for universities and research institutes, with experience in micro-electroplating, electroless plating and related electroplating processes.