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Electroplating
MEMS Foundry Services
MEMS processing
Electroplating
Electroplating Overview
Electroplating is a process that uses chemical methods to deposit noble metals onto specific electrodes. Its basic principle is similar to traditional electroplating, but it requires higher precision and process control. Electroless plating refers to the deposition of metal ions from an aqueous solution onto a substrate by chemical reduction under controlled conditions without external current. Semicon Global Tech provides MEMS foundry services and supports micro-electroplating, electroless plating and other electroplating processes.
Electroplating Technologies
Wafer-Level ElectroplatingAu, Cu, Ni, Sn
Non-Standard Micro-ElectroformingAu, Cu and Ni electroplating for non-standard sizes and flexible substrates
Electroless Nickel Palladium GoldElectroless Ni/Pd/Au plating for selected MEMS and semiconductor applications
Case Studies
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