Semicon Global Tech
Thin-Film Deposition
MEMS Foundry Services
MEMS processing
Thin-Film Deposition
Thin-Film Deposition Overview
Thin-film deposition is a common surface treatment process. Under vacuum conditions, a metal or non-metal material is deposited onto the surface of a substrate in vapor phase to form a dense thin film. Film quality is critical to the functional formation of semiconductor devices. Semicon Global Tech provides MEMS foundry services and supports multiple thin-film deposition technologies.
Deposition Services
Oxide / nitride films, metal films, optical films, composite films and other customized thin-film deposition services.
Deposition Materials
MetalsTi, Al, Ni, Au, Ag, Cr, Pt, Cu, Pd, Zn, Mo, W, Ta, Nb and other metal coating materials
Non-metalsSi, SiO₂, SiNₓ, Al₂O₃, HfO₂, MgF₂, Ta₂O₅, ITO and other non-metal coating materials
Deposition Substrates
SubstratesSilicon wafers, quartz glass wafers, sapphire wafers, PET, PI and other substrates
Substrate Size2–8 inches
Film Thickness and Surface
ThicknessNanometer-level and micrometer-level thicknesses; customizable on request
SurfaceSingle-sided or double-sided deposition
Deposition Technologies
Electron-Beam EvaporationTi, Al, Ni, Ag, Cu, Cr, Sn, Pt, AuGe
Magnetron SputteringTi, Al, Ni, Au, Ag, Cr, Pt, Cu, TiW90, Pd, Pt, Zn, Mo, W, Ta, Ru, Si, SiC, NiCr20, Nb
LPCVD (Low-Pressure Chemical Vapor Deposition)SiNₓ, Poly-Si; wafer-level uniformity: <±5%
PECVD (Plasma-Enhanced Chemical Vapor Deposition)SiO₂, SiNₓ, a-Si (B/P doped)
ALD (Atomic Layer Deposition)Al₂O₃, HfO₂, AlN, ZrO₂, SiO₂, TiN, TiO₂
Case Studies
LPCVD SIN
PECVD SIN
Customized service
Customized service
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