Wafer Bonding Services | MEMS Packaging and Substrate Integration

Wafer Bonding

Wafer Bonding Overview

Wafer bonding joins two clean, atomically flat homogeneous or heterogeneous semiconductor material surfaces after surface cleaning and activation. Under controlled conditions, the wafers are bonded into an integrated structure through van der Waals forces, molecular forces or even atomic forces. Semicon Global Tech provides MEMS foundry services and has experience with multiple wafer bonding technologies.

Anodic Bonding

Anodic Bonding	An electric-field-assisted bonding technology	Suitable for	Bonding between silicon wafers and glass, metal and glass, semiconductors and alloys, and semiconductors and glass
Eutectic Bonding	Also known as electrostatic bonding in some process contexts. It uses a low-melting-point alloy as an intermediate layer, such as gold-tin (Au-Sn). When heated to the eutectic temperature, the liquid metal fills microscopic surface recesses and forms a solid metal bond after cooling, creating a strong connection.	Suitable for	PbSn, AuSn, CuSn, AuSi and related material systems
Adhesive Bonding	Uses selected bonding adhesives to connect two surfaces.	Adhesives	AZ4620, SU-8 and other dedicated bonding adhesives
Applicable wafer sizes	4-inch and 6-inch wafers

Eutectic Bonding

Eutectic bonding uses metal alloy systems such as AuSn, PbSn, CuSn or AuSi to form a stable bonded interface at controlled temperature.

Adhesive Bonding

Adhesive bonding uses materials such as AZ4620 or SU-8 to join two wafer or substrate surfaces for MEMS packaging and structure integration.

Case Studies