Semiconductor Materials

Home > Semiconductor Materials > Quartz Wafers >

Quartz & Fused Silica Material Catalogue

Quartz Wafers

Material selection is organized by spectral band, OH content, purity, optical homogeneity and thermal performance—not only by the generic word “quartz.”

Existing Quartz Wafer Supply

Quartz Wafer Overview

Quartz wafers offer excellent optical performance, thermal shock resistance, low thermal expansion coefficient, high-temperature resistance, chemical stability and good electrical insulation. They are widely used in semiconductor manufacturing, electro-optical sources, semiconductor communication devices, lasers, optical instruments, laboratory instruments, electrical equipment, medical equipment, high-temperature and corrosion-resistant chemical instruments, chemical engineering, electronics, metallurgy, building materials and defense industries, as well as printing and dyeing, plastics, food processing and healthcare applications.

Quartz Wafer Specifications

Semicon Global Tech provides quartz wafers in multiple specifications.

Case Studies

Original manufacturer reference series

Corning · High-purity fused silica

Corning HPFS® 7979, 7980 & 8655 Fused Silica

Non-crystalline high-purity fused silica grades differentiated by OH content, inclusion and homogeneity classes, birefringence and UV/IR transmission performance.

UV / IR gradesLow CTEOH-controlled

View specifications and alternatives →

Common supply forms

Fused-silica wafers and discs
Optical windows, plates and custom outlines
UV, DUV, IR and thermal-process grade selection
Polished, cleaned, drilled, slotted or edge-finished components

Semicon Global Tech supply option

China-Made Fused Silica Alternatives

Chinese fused-silica grades are matched to the actual optical and process requirement. For HPFS-type projects we review OH, metallic impurities, inclusion/bubble class, homogeneity, birefringence, transmission wavelength, laser durability and thermal history.

This approach supports cost and lead-time optimization while keeping the qualification target explicit.

Customization

Round wafers, square panels, windows and custom outlines
Precision cutting, edge grinding, chamfering and laser processing
Single- or double-side polishing, thinning, cleaning and marking
TTV, warp, roughness, dimensional and optical inspection to agreed criteria

Qualification principle: UV/DUV, laser and high-temperature parts require grade-specific test data and approved samples. A generic fused-silica certificate is not automatically sufficient.

Share your wavelength and process conditions

We can compare the named HPFS grade with a Chinese high-purity fused-silica candidate.

Request a comparison

Legal Notice | Privacy Policy |