Semicon Global Tech
Semiconductor Materials
Semiconductor Materials
Silicon Wafers
Silicon Wafer Overview
A silicon wafer generally refers to a thin slice cut from single-crystal silicon. Silicon wafers are available in diameters such as 2 inches, 3 inches, 4 inches, 6 inches and 8 inches, and are mainly used to manufacture integrated circuits. The wafer is the raw material, while the chip is the finished product. Silicon wafers are important materials for integrated circuit manufacturing; through lithography, ion implantation and other processes, they can be made into various semiconductor devices.
Silicon Wafer Specifications
Semicon Global Tech provides single crystal silicon wafers in sizes of 2 inches, 3 inches, 4 inches, 6 inches, 8 inches, etc
2 inch 3 inch 4 inch 6 inch 8 inch
Inch Diameter / mm Polished Side Doping Crystal Orientation Resistivity / Ω·cm Thickness / μm
2 inch 50.8±0.5 Double-side polished P/N 100 1–20 200-500
Single-side polished
3 inch 76 Double-side polished P/B 100 NA 525±20
Single-side polished
4 inch 100±0.2 Double-side polished P/N 100 0.001-10 200-2000
100±0.3 Single-side polished
100±0.4
6 inch 150±0.3 Double-side polished P/N 100 1–10 500-650
Single-side polished
8 inch 200±0.3 Double-side polished P/N 100 0.1-20 625
Single-side polished
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Semiconductor Materials
Glass Wafers
Glass Wafer Overview
BF33 glass is a high-quality borosilicate glass. It offers a suitable coefficient of thermal expansion, excellent surface flatness, transparency and good optical performance, meeting the special requirements of high-speed laser debonding processes. In wafer thinning processes, BF33 glass wafers can be used for anodic bonding or as carrier wafers.
Glass Wafer Specifications
Semicon Global Tech provides BF33 glass wafers in 4-inch, 6-inch and other specifications.
4 inch 6 inch
Inch Diameter / mm Polished Side Thickness Notes
4 inch 100±0.3 Double-side polished 500±10 BF33 Glass Wafers
6 inch 150±0.3 Double-side polished 300,500
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Semiconductor Materials
Quartz Wafers
Quartz Wafer Overview
Quartz wafers have excellent optical performance, along with thermal shock resistance, low thermal expansion coefficient, high-temperature resistance, good chemical stability and excellent electrical insulation. Therefore, they are widely used in semiconductor manufacturing, electric light sources, semiconductor communication devices, lasers, optical instruments, laboratory instruments, electrical equipment, medical devices, high-temperature and corrosion-resistant chemical instruments, chemical, electronics, metallurgy, building materials, defense, printing and dyeing, plastics, food processing and medical and health industries.
Quartz Wafer Specifications
Semicon Global Tech provides quartz wafers in multiple specifications.
1 2 3 4 5
Diameter / mm Thickness / mm Notes
100mm 500um 1mm For other sizes, please contact us.
150mm 500um 1mm
100*100mm 160um 500um
100mm 155um 260um
200mm 1mm 2mm
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Semiconductor Materials
PI Films
PI Film Overview
Polyimide (PI) is one of the polymer materials with extremely excellent temperature resistance. It also offers good chemical stability and mechanical properties, making it a highly promising flexible substrate material. As a special engineering material, PI has been widely used in aviation, aerospace, microelectronics, nanotechnology, liquid crystals, separation membranes, lasers and other fields.
PI Film Specifications
Semicon Global Tech provides PI polyimide flexible substrates in multiple specifications.
4 inch
Product Introduction In semiconductor applications, PI refers to the high-performance polymer material polyimide. It has excellent overall performance, including flexibility, high-temperature resistance and insulation.
Thickness 0.025 mm, 0.05 mm, 0.075 mm, 0.01 mm, 0.125 mm, 0.175 mm, 0.2 mm, 0.25 mm, etc. For detailed sizes, please contact us.
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Semiconductor Materials
SOI Wafers
SOI Wafers
SOI (Silicon-On-Insulator) wafers place a thin silicon layer on an insulating substrate. Transistors are fabricated on this thin silicon layer known as SOI. Devices based on SOI structures can inherently reduce junction capacitance and leakage current, improve switching speed, reduce power consumption and achieve high-speed, low-power operation. As a next-generation silicon-based integrated circuit technology, SOI is widely used in most microelectronics fields and also in optoelectronics, MEMS and other areas.
SOI Wafer Specifications
Semicon Global Tech provides SOI wafers in specifications such as 4–8 inches.
Outline Size 4"、5"、6"、8"
Process Smart cut:Bonding;SIMOX
Type N/P
Top Single-Crystal Silicon Thickness 0.22~50μm
Buried Oxide Thickness 0.1~4μm
Handle Layer Thickness 100~500μm
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Semiconductor Materials
Photomasks
Photomask Overview
A photomask is one of the important materials used in the lithography process. It is also known in the industry as a mask plate, mask or lithography mask. Photomask types include quartz substrates, soda-lime glass substrates and film masks.
Photomask Types and Process Accuracy
Photomask Types Quartz substrates
Soda-Lime Glass Substrates
Film Masks
Process Capabilities Customizable from 2.5 inch to 9 inch
Soda-lime mask accuracy ±0.3 μm
Quartz mask accuracy ±0.1 μm
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Semiconductor Materials
Photoresists
Photoresist Overview
Photoresist, also called a photo-sensitive resist, is a resist thin-film material whose solubility changes under exposure or radiation from ultraviolet light, electron beams, ion beams, X-rays and other sources. It can be used for deep silicon etching and is suitable for high-aspect-ratio processes, with high transparency and good verticality.
Photoresist Specifications
Semicon Global Tech provides multiple types and specifications of photoresists.
Type Photoresist Models Thickness / μm Resolution Applicable Process
AZ Series AZ5214, AZ4620, AZ6130, etc. 1-30um 1um Can be used for deep silicon etching
PI LTC9000 Series 4-50um 4um Used for non-copper substrate processes; curing temperature can be as low as 250°C
Electron-Beam Resists HSQ Fox-15/16 100nm 350nm-810nm Photoresists with high-resolution properties and etch resistance
Lift-off Photoresists LOR / PMGI-SF Series 50nm-6um High-resolution bottom resist for bilayer lift-off processes
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Semiconductor Materials
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