Polishing uses mechanical, chemical or electrochemical action to reduce the surface roughness of wafers and other workpieces, obtaining a bright and flat surface. It modifies the workpiece surface using polishing tools, abrasive particles or other polishing media. Semicon Global Tech provides MEMS foundry services and is experienced in mechanical polishing, chemical polishing and chemical mechanical polishing for wafers, chips and semiconductor substrates.

Mechanical polishing, chemical polishing and chemical mechanical polishing.

Si, GaAs, GaN, InP, glass, sapphire, ceramics and other wafer or precision substrate materials.

Surface roughness: 1–50 nm