Fusion-formed borosilicate glass with an optical-quality surface, low thickness variation and thermal expansion compatible with silicon-based MEMS packaging.
View specifications and alternatives →Fusion-formed alkaline-earth boro-aluminosilicate substrate glass designed for flat-panel display and thin-film processing.
View specifications and alternatives →Ion-exchange strengthened cover glass developed for damage resistance, scratch resistance and retained strength in touch and portable-device applications.
View specifications and alternatives →Thin protective cover glass focused on damage resistance, retained strength and improved drop performance after ion exchange.
View specifications and alternatives →Ultra-flat optical-grade semiconductor glass supplied as wafers or large panels, with a nominal CTE of 3.4 × 10⁻⁶/°C.
View specifications and alternatives →Ultra-flat optical-grade semiconductor glass with a nominal CTE of 7.8 × 10⁻⁶/°C, available in wafer and panel formats.
View specifications and alternatives →Aluminosilicate ultra-thin glass suitable for ion-exchange strengthening and applications requiring impact, bending and scratch resistance.
View specifications and alternatives →Clear optical crown glass with high visible transmission, established optical constants and broad use in optical and technical components.
View specifications and alternatives →Clear, chemically durable borosilicate thin glass supplied in stock sheets and customizable substrate formats.
View specifications and alternatives →Chemically strengthen-able cover glass engineered for drop and scratch resistance in premium device applications.
View specifications and alternatives →Lithium-alumino-borosilicate cover glass developed for enhanced rough-surface drop and scratch performance after chemical strengthening.
View specifications and alternatives →Overflow-formed alkali-free substrate glass with smooth surfaces and high thermal and dimensional stability for display and thin-film processing.
View specifications and alternatives →Existing glass-wafer supply option for MEMS, anodic bonding and carrier-wafer applications. Detailed original-grade data will be added after the corresponding manufacturer sheet is approved.
Request BF33 specification →| Application family | Reference models | Key selection criteria |
|---|---|---|
| Low-CTE MEMS / packaging | PYREX Micro-Electro, SG 3.4 and BF33-type targets | CTE, anodic bonding, TTV, warp, surface finish |
| Display / thin-film substrate | EAGLE XG and NEG OA-10G / OA-11 | Alkali content, strain point, thermal shrinkage, sheet size |
| Strengthened cover glass | Gorilla Glass 3/4, AS 87 eco, Xensation Core / α | Ion exchange, CS/DoCL, thickness, scratch and drop tests |
| Thin / optical technical glass | D 263 T eco and B 270 i | Transmission, refractive index, CTE, chemical durability, thickness |
We do not relabel Chinese material as an original brand. We select a Chinese glass grade against the customer’s application and the critical reference parameters: composition family, CTE, optical band, refractive index, alkali content, thermal point, strengthening response, thickness, TTV, warp and surface finish.
Potential alternatives can be supplied as raw sheets, round wafers, square panels or processed components.
We can prepare an original-grade quotation, a Chinese-alternative proposal, or a side-by-side qualification matrix.
Start a material inquiryAll trademarks belong to their respective owners and are used for material identification and comparison. Alternative products are independently sourced and are not represented as products of the original manufacturer.
