MEMS micro/nano fabrication has a significant influence on semiconductor manufacturing. It extends conventional semiconductor processing from planar electronic structures to mechanical, optical, fluidic and sensing structures, enabling chips to interact with the physical world.

For semiconductor manufacturing, MEMS processes provide capabilities for miniaturized sensors, actuators and functional microstructures. Processes such as lithography, etching, deposition, bonding, thinning and packaging are adapted to form cavities, membranes, cantilevers, microchannels and high-aspect-ratio silicon structures.

MEMS manufacturing also promotes integration. Sensors can be combined with signal-processing circuits, enabling smaller modules, lower power consumption and faster response. This is especially important for smartphones, automotive electronics, industrial monitoring, medical devices and IoT systems.

At the process level, MEMS drives improvements in wafer bonding, deep silicon etching, thin-film stress control and wafer-level packaging. These technologies support both MEMS devices and advanced semiconductor manufacturing.

As semiconductor products move toward higher integration and more intelligent functions, MEMS micro/nano fabrication will continue to expand the application boundary of chips and provide important process support for next-generation sensing and smart systems.